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Spin
coating MachinesSpin coating is a procedure used to apply uniform thin
films to flat substrates. In short, an excess amount of a solution is
placed on the substrate, which is then rotated at high speed in order to
spread the fluid by centrifugal force. A machine used for spin coating
is called a spin coater, or simply spinner.
Rotation is continued while the fluid spins off the edges of the
substrate, until the desired thickness of the film is achieved. The
applied solvent is usually volatile, and simultaneously evaporates. So,
the higher the angular speed of spinning, the thinner the film. The
thickness of the film also depends on the concentration of the solution
and the solvent.
Spin coating is widely used in microfabrication, where it can be used to
create thin films with thicknesses below 10 nm. It is used intensively
in photolithography, to deposit layers of photoresist about 1 micrometre
thick. Photoresist is typically spun at 20 to 80 Hz for 30 to 60 seconds
Spin Coater Chuck Selection
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SCS chucks are machined to close tolerances and provide an exceptionally
flat, rigid surface for mounting substrates of different sizes, weights,
and shapes. Custom chucks are also available.
Proper chuck selection should be based upon substrate size and rigidity. The proper chuck diameter is 1/4 to 1 inch smaller than the substrate diameter. The entire substrate should be supported if it is flexible, fragile, or when it is to be wiped or brushed during cleaning. Vacuum chucks are available in stainless steel, hard anodized aluminum, or DELRIN®. Please specify the material of choice and chuck size when ordering.
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Type CS Chuck Used to hold a thin, planar surfaced substrate such as silicon, glass, or germanium on a spinning shaft for higher or maximum RPMs. |
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Type H Chuck Used to hold relatively heavy substrates such as glass, quartz, ceramic, metal, etc. |
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Type L Chuck Used to hold heavy, large or unsymmetrical substrates. The guide fingers assist in proper positioning and holding of the substrate. |
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Type R Chuck Used to hold square or rectangular substrates. Design achieves a uniform coating across the entire substrate. Custom milled recess holds substrate. |




